Provided is a semiconductor device suitable for miniatur ization and higher density. The
semiconductor device includes a first transistor, a second transistor overlapping with the first …

the present disclosure generally relates to a chip assembly configuration that
accommodates semiconductor chips. More specifically, the present disclosure relates to a …

An electrical device that includes a first semiconductor device positioned on a first portion of
a Substrate and a second semiconductor device positioned on a third portion of the …

Provided is a semiconductor device suitable for miniatur ization and higher density. The
semiconductor device includes a first transistor, a second transistor overlapping with the first …

(57) ABSTRACT A method for manufacturing a semiconductor device includes: forming a
first and second layers not firmly adher ing to each other over a substrate; forming a first …

The semiconductor module includes a semiconductor chip and a semiconductor chip. The
semiconductor chip includes an optical device such as an optical waveguide, an optical …

(57) ABSTRACT A semiconductor device includes a first Substrate, a second substrate, a
plurality of through vias (TVs), and a plurality of conductive caps. The first substrate has at …

The semiconductor module includes a first semiconductor chip and a second semiconductor
chip. The first semiconductor chip includes an optical device such as an optical waveguide …

2017-02-08 Assigned to SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
reassignment SEMICONDUCTOR ENERGY LABORATORY CO., LTD. ASSIGNMENT OF …

The present disclosure, in some embodiments, relates to an integrated chip structure. The
integrated chip structure includes a standard via disposed on a first side of a substrate. An …