Thermal management in integrated circuit packages

F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent …, 2023 - Google Patents
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Thermal management in integrated circuit packages

F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent App. 16 …, 2021 - Google Patents
US20210043573A1 - Thermal management in integrated circuit packages - Google Patents
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Thermal management in integrated circuit packages

F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent …, 2023 - Google Patents
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Enhanced base die heat path using through-silicon vias

W Bertrand, K Arrington, S Devasenathipathy… - US Patent …, 2024 - Google Patents
Embodiments of the present disclosure may generally relate to systems, apparatuses,
techniques, and/or processes directed to packages that include stacked dies that use …

Soldered metallic reservoirs for enhanced transient and steady-state thermal performance

N Neal, NS Haehn, SC ARGUEDAS… - US Patent App. 18 …, 2023 - Google Patents
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thermal performance - Google Patents US20230343723A1 - Soldered metallic reservoirs for …

Thermal management in integrated circuit packages

F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent …, 2024 - Google Patents
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C2N) C1= NNC= C1) C (C)= O Chemical compound CCN (CC1= NC2= C (N1) C1= CC= C …