Reliability of MEMS: A perspective on failure mechanisms, improvement solutions and best practices at development level
J Iannacci - Displays, 2015 - Elsevier
Abstract Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect
as it can discriminate the successful from partially or totally missed reaching of Microsystem …
as it can discriminate the successful from partially or totally missed reaching of Microsystem …
Study on board-level reliability of passive components on ultra-high density PCB assemblies
X Lv, H Shi, M Li, Q Jia, C Yang - 2023 IEEE 25th Electronics …, 2023 - ieeexplore.ieee.org
With the development of electronic packaging technology, the functions of mobile phones
are becoming increasingly complex and the size is becoming smaller, and the requirements …
are becoming increasingly complex and the size is becoming smaller, and the requirements …
The effect of reflow process on the physical properties of die attach adhesives
MAF Sanei, L Frisk - Procedia Engineering, 2016 - Elsevier
Suitable selection of packaging materials is critical for microelectromechanical system
(MEMS) devices to maintain their performance and to provide physical protection, mainly to …
(MEMS) devices to maintain their performance and to provide physical protection, mainly to …
Stress and Strain Modeling of Low Temperature Cofired Ceramic (LTCC) Seal Frame and Lid
D Krueger, J Porter, K Peterson - Additional Papers and …, 2015 - meridian.allenpress.com
Low temperature cofired ceramic (LTCC) is established as an excellent packaging
technology for high reliability, high density microelectronics. LTCC multichip modules …
technology for high reliability, high density microelectronics. LTCC multichip modules …
The Reliability of Through Glass Vias and Solder Joints for Three Dimensional Multi Functional Integrated Systems
O Ahmed - 2020 - stars.library.ucf.edu
Abstract Three-dimensional (3D) integration technologies, including interposer-based
integration, are among the most promising solutions to meet the increased demand for high …
integration, are among the most promising solutions to meet the increased demand for high …
[PDF][PDF] Challenges in LTCC.
KA Peterson, D Krueger, M Girardi, JA Wolf, PT Vianco… - 2015 - osti.gov
• Die areas green machined to the layer 7 ground plane• GaAs and GaN die epoxied to the
heat spreader• Heat spreader epoxied die attached into cavity• No thin film in the cavity• …
heat spreader• Heat spreader epoxied die attached into cavity• No thin film in the cavity• …