The increasing component packing density and consequent reduction in feature size in
printed circuit assemblies (PCA's) continues to place manufacturers under extreme …

Advanced electronics packaging technologies such as chip scale packages, fine pitch ball
grid arrays, and flip chip are pushing solder paste stencil printing to the limit. In order to …

This paper presents work done in the modelling of solder paste printing, a crucial process in
the reflow soldering of surface mounted electronic components. The map summarises the …

Stencil design plays a major role in the printed circuit board assembly (PCBA)
manufacturing process. The design of the stencil often determines the end results in terms of …

In this paper, particle level modelling for solder paste viscosity measurement was described
to investigate the non-Newtonian rheological behaviour of solder pastes. The model based …

The results from the development of a novel technique for detecting and monitoring load
bearing, percolating networks in a dense suspension (concentrated suspension) sheared in …

To successfully print solder paste onto circuit boards using stencils, a properly controlled fill-
in process must be followed by an efficient snap-off. Due to the non-Newtonian nature of …