Corrosion characterization of Sn-Zn solder: a review

MF Mohd Nazeri, MZ Yahaya, A Gursel… - Soldering & Surface …, 2019 - emerald.com
Purpose The purpose of this paper is to review and examine three of the most common
corrosion characterization techniques specifically on Sn-Zn solders. The discussion will …

Recent advances in method of suppressing dendrite formation of tin-based solder alloys

B Liao, H Wang, W Xiao, Y Cai, X Guo - Journal of Materials Science …, 2020 - Springer
With the trend towards miniaturization and high density in electronics, electrochemical
migration (ECM) of tin-based solder alloys is becoming an increasingly serious issue …

Corrosion and Leaching Behaviours of Sn‐0.7 Cu‐0.05 Ni Lead‐Free Solder in 3.5 wt.% NaCl Solution

JEC Guerrero, DH Camacho, O Mokhtari… - … Journal of Corrosion, 2018 - Wiley Online Library
The corrosion and leaching behaviour of a new ternary Sn‐0.7 Cu‐0.05 Ni alloy in 3.5 wt.%
NaCl solution is reported herein. Potentiodynamic polarization measurements show that Sn …

Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5 wt% Zn-0.5 wt% X (X= Ag, Al, Cu) lead-free …

R González-Parra, O Novelo-Peralta… - Journal of Materials …, 2024 - Springer
Lead-free solders are promising candidates for the replacement of Sn–Pb solders due to
their environmental friendly, good thermal properties and wettability which render them …

Corrosion properties of SAC305 solder in different solution of HCl and NaCl

MZ Nurwahida, MM Mukridz, AM Ahmad… - IOP Conference …, 2018 - iopscience.iop.org
Potentiodynamic polarization was used to studied the corrosion properties of SAC305 solder
in different solution of 1.0 M HCl and 3.5 wt.% NaCl using the same scanning rate of 1.0 …

Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

NBM Zaini, MFBM Nazeri - AIP Conference Proceedings, 2016 - pubs.aip.org
The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid
(HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of …

Microstructural aspects of fatigue parameters of lead-free Sn-Zn solders with various Zn content

K Pietrzak, A Klasik, M Maj… - Archives of Foundry …, 2017 - yadda.icm.edu.pl
The study includes the results of research conducted on selected lead-free binary solder
alloys designed for operation at high temperatures. The results of qualitative and …

Microstructure, interfacial IMC layer and mechanical properties of Cu/Sn-9Zn-xZrC/Cu solder joints

L Yang, B Song, Y Zhang, Y Xiong… - Materials Research …, 2018 - iopscience.iop.org
The effect of trace ZrC on the wettability, microstructure and mechanical properties of Sn-9Zn
composite solder alloy joints was investigated. The results indicated that the wettability of the …

Effect of cyclic stress on electrochemical corrosion behavior of SAC305 solder

G Chen, YY Wang, XH Wang… - Journal of …, 2022 - asmedigitalcollection.asme.org
The effects of cyclic stress on the polarization curve of SAC305 lead-free solder are
investigated. It is found that stress increases the corrosion tendency of the material. The …

SnZn 系无铅钎焊料的发展现状与展望

姜兴振, 张建波, 陈辉明, 肖翔鹏, 郭诚君 - 有色金属材料与工程, 2015 - snm.usst.edu.cn
阐述了无铅焊料的发展过程, 对Sn-Zn 系无铅焊料发展现状及研究进行了介绍.
详细分析了一些合金元素添加后对Sn-Zn 系钎焊料的影响, 同时叙述了对Sn-Zn 焊料与Cu, Al …