An introduction to the exciting and continuously growing topic of IC packaging is presented
herein. This review starts with a beginner's level introduction to microelectronic packaging …

A glass vacuum package based on localized aluminum/silicon-to-glass bonding has been
successfully demonstrated. A constant heat flux model shows that heating can be confined …

Although MEMS technologies and device structures have made significant progress in the
past three decades and have found widespread application in many areas, including Micro …

A variety of microelectromechanical system devices requires encapsulation of their crucial
fragile parts in a hermetically sealed cavity for reasons of protection. Hermeticity of the cavity …

(57) ABSTRACT A low temperature method for forming a microcavity on a Substrate and
article having same are provided which utilize electroplated films. The method is particularly …

The present work theoretically and quantitatively investigates the geometrical effects of the
electrode containing a coolant hole on heat transfer or temperature gradient, and …

The effect of process parameters on the residual gases, H 2 O, O 2, CO 2 and H 2 in the
metal package were investigated in this study. It was found that the H 2 O mainly came from …

This study theoretically investigates workpiece property effects on nugget microstructure
determined by temperature gradient and solidification rate during resistance spot welding …

Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters
discusses radio frequency microelectromechanical systems (RF MEMS)-based control …

Resonant type capacitive MEMS transducers were fabricated using a multi-user MEMS
process (MUMPs) for the detection of acoustic emission (AE). Electrical and mechanical …