This paper provides an overview of state-of-the-art sensing and machine learning
technologies for intelligent measurement in smart and precision manufacturing. Length …

This study analyzed the material removal mechanism in chemical mechanical polishing
(CMP) via in-situ observation using an evanescent field. In particular, the contact interface …

As semiconductor devices become smaller, having ultra-smooth and flawless surfaces is
crucial. The manufacturing of advanced devices requires strict conditions to avoid defects …

Abstract Chemical Mechanical Polishing (CMP) has been utilized for surface topography
control and planarization since it was introduced in semiconductor fabrication. However, the …

Cleaning of surfaces polished with ceria particles is achieved using brush scrubbing. In the
presence of additives like proline, this becomes more challenging. Here, we quantified the …

The cleaning mechanism for brush scrubbing, known as the contact-type cleaning method,
utilizes the direct contact of impurities onto brushes or brush-induced fluid flow depending …

To directly investigate the dynamic nanoscale phenomenon on the surface being processed
in wet conditions such as precision polishing, and cleaning in semiconductor industrial, an …

The use of polyvinyl acetal (PVA) brushes is one of the most effective and prominent
techniques applied for the removal of chemical mechanical planarization (CMP) …

Chemical mechanical planarization (CMP) is the only process capable of achieving global
planarization for both dielectric structures and metal interconnects that are integral parts of …

抄録 Droplet collision to the liquid film flow was observed experimentally. Liquid film flow
was formed on the acrylic plate. Droplet with black ink was dropped on the liquid film flow …