In this study, the authors have reviewed recent advances on the transient liquid phase (TLP)
bonding technology for various applications especially power module packaging in view of …

With the continuous miniaturization of electronic devices and the upcoming new
technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation …

With high conductivity and stretchable for large cross-sections, liquid metals such as
galinstan are promising for creating stretchable devices and interconnects. Creating high …

Real-time health monitoring of civil infrastructures is performed to maintain their structural
integrity, sustainability, and serviceability for a longer time. With smart electronics and …

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …

Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu
microbump were systematically investigated by an in-situ scanning electron microscope …

Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC)
layer formation of Sn-3.0 Ag-0.5 Cu (SAC305)/CNT/Cu solder joint according to the …

This study aims to enable roll-offset (RO) printing for fabrication of solder bump arrays for
microelectronic packaging by developing lead-free solder paste optimized for RO printing …

Paste spreadability is critical to paste spread layer and thus the quality of final product in
pressureless sintering of nano-Ag, but the metrics and the underlying mechanics have not …

Abstract Sn–Ag–Cu based alloys are a series of important candidates of lead-free solders.
However the melting temperatures are still higher than the traditional Sn–Pb solder. Gallium …