Chiplet heterogeneous integration (CHI) is one of the important technology choices to
continue Moore's law. However, due to the characteristics of high power and low supply …

The resurgence of wafer-scale heterogeneous integration necessitates efficient simulation
methodologies to enable thermal-aware design space exploration, particularly for iteration …

Chiplet architectures are a promising paradigm to overcome the scaling challenges of
monolithic chips. Chiplets offer heterogeneity, modularity, and cost-effectiveness. The …

This paper proposed the carbon materials (including MLGNR, MWCNT and SWCNT) to
replace the traditional Cu as the filler of through silicon via (TSV) for enhancing heat transfer …

In this article, we present an efficient transient electromagnetic–thermal co-simulation solver
based on the hybrid implicit–explicit finite-difference time-domain (HIE-FDTD) method. This …

Multi-chiplet system design, by integrating multiple chiplets/dielets within a single package,
has emerged as a promising paradigm in the post-Moore era. This paper introduces a novel …

Due to a variety of limitations on the system-on-chip (SoC), the microelectronics industry is
now facing challenges and making slow progress in recent years. With architecture design …

As mobile systems become more advanced, the security of System-on-Chips (SoCs) is
increasingly threatened by thermal attacks. This research introduces a new attack method …

The multi-chiplet technique is expected to be a promising solution to achieve high-density
system integration with low power consumption and high usage ratio. This technique can be …