Punch-through stop doping profile control via interstitial trapping by oxygen-insertion silicon channel

H Takeuchi, RJ Mears, RJ Stephenson… - IEEE Journal of the …, 2017 - ieeexplore.ieee.org
Interstitial trapping by oxygen-inserted silicon channel results in blocking of boron and
phosphorus transient enhanced diffusion as well as retention of channel boron profiles …

Effects of oxygen-inserted layers on diffusion of boron, phosphorus, and arsenic in silicon for ultra-shallow junction formation

X Zhang, D Connelly, H Takeuchi, M Hytha… - Journal of Applied …, 2018 - pubs.aip.org
The effects of oxygen-inserted (OI) layers on the diffusion of boron (B), phosphorus (P), and
arsenic (As) in silicon (Si) are investigated, for ultra-shallow junction formation by high-dose …

A Novel Sample Preparation Approach for Dopant Profiling of 14 nm FinFET Devices with Scanning Capacitance Microscopy

N Adhikari, P Kaszuba, G Mathieu… - … for Testing and …, 2020 - dl.asminternational.org
Three-dimensional device (FinFET) doping requirements are challenging due to fin sidewall
doping, crystallinity control, junction profile control, and leakage control in the fin. In addition …

Analysis of the Effects of Boron Transient Enhanced Diffusion on Threshold Voltage Mismatch in Steep Retrograde Doping NMOSFETs with Inserted Oxygen Layers

S Fujii, H Takeuchi, S Morita, T Yagi… - … Symposium on the …, 2020 - ieeexplore.ieee.org
Steep retrograde doping devices were fabricated using undoped epitaxial Si channels with
inserted oxygen layers. The effects of boron transient enhanced diffusion (TED) on threshold …

Experimental Understanding of the Impact of Channel Percolation on Low Frequency Noise Using Transient Enhanced Diffusion of Channel Dopants

S Fujii, S Morita, T Miyazaki - 2021 5th IEEE Electron Devices …, 2021 - ieeexplore.ieee.org
This paper investigates the impact of channel percolation on low frequency noise (LFN).
Using transient enhanced diffusion (TED) of channel dopants, the degree of channel …

Applications of Oxygen Inserted Silicon Devices in Power and RF

RJ Mears, H Takeuchi, YA Chen… - 2020 4th IEEE …, 2020 - ieeexplore.ieee.org
Insertion of partial monolayers of oxygen during silicon epitaxy (OI) has been shown
experimentally and by simulation to facilitate the blocking interstitials during oxidation and …

[PDF][PDF] Improving low-voltage integrated power devices

J Toonen, IA Mels, IHGA Huizing - research.tue.nl
This thesis on “Improving low-voltage integrated power devices: a simulation and
experimental based study” marks the end of my graduation project, which completes my …