The defect inspection of flip chips has become a meaningful and challenging task with the
decrease of size and distance of solder balls. In this paper, we proposed a novel defect …

Flip chip technology has been widely used in IC packaging, and the combination of flip chip
technology and solder joint interconnection technology has been utilized in the …

Solder bumps realize the mechanical and electrical interconnection between chips and
substrates in surface mount components, such as flip chip, wafer level packaging and three …

Flip chip has been extensively used in microelectronic packaging industry. With the trend of
solder bumps towards small volume and ultra-fine pitch, defect inspection of flip chips has …

随着“后摩尔时代” 到来, 先进封装技术使芯片性能不断提升, 传统的材料开发制备以及封装互连
研究难以适应时代需要. 根据工业4.0 的愿景, 采用机器学习的算法在封装材料开发预测 …

Machine learning is widely used in industrial diagnosis and can be used to obtain accurate
results automatically and online. The flip chip is a useful technology for microelectronic …

With the advent of “post-Moore era”, advanced packaging technology improves the
performance of chips, and traditional materials development and preparation and research …

Flip chip is the main component of a RFID tag. It is used in billions each year in electronic
packaging industries because of its small size, high performance and reliability as well as …

As a highly precision product, passive RFID tag joints are usually in the size of 50-150 μm.
Their natural frequencies play a significant role in long-term tag life and read distance. When …

Natural frequencies of passive radio frequency identification (RFID) tags were studied as
they played a great role for their reliability. Both analytical and numerical predictions …