This paper develops an assessment methodology based on vibration tests and finite
element analysis (FEA) to predict the fatigue life of electronic components under random …

Abstract The Mean Time to Failure (MTTF) is a critical metric for assessing the reliability of
non-repairable systems, and it plays a significant role in incident management. However …

The remaining useful life (RUL) of electronic modules under the influence of rugged random-
vibration and operational conditions is investigated in this paper. The effects of storage …

Fatigue life predictions for ball grid arrays (BGA) in electronic devices under random
vibration have been made using the finite element method (FEM). Three different circuit …

In this paper, we presented several practical aspects for building robust and reliable finite
element models in thermomechanical modeling in electronics packaging using finite …

This paper presents a general methodology to predict the fatigue life of the Package-on-
Package (PoP) under random vibration loading by means of vibration tests and finite …

Solder joint fatigue failure under vibration loading has been a great concern in
microelectronic industry. High-cycle fatigue failure of lead-free solder joints has not been …

This work investigates finite element (FE) simulation and fatigue life prediction of ball grid
array (BGA) under random vibration loading. The printed circuit board (PCB) assemblies are …

Comprehensive rapid reliability analysis of electronic devices in the design level while
simultaneously considering all the crucial parameters is undoubtedly of paramount …

In this work, the combination of vibration loading and thermal cycle effects on the fatigue
properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) …