A review of recent progress in lasers on silicon
The absence of integrated sources of light has always been regarded as a serious obstacle
to silicon photonics. The inherent indirect band structure makes silicon a poor emitting …
to silicon photonics. The inherent indirect band structure makes silicon a poor emitting …
CMOS-compatible Tungsten heaters for silicon photonic waveguides
A Masood, M Pantouvaki, D Goossens… - The 9th International …, 2012 - ieeexplore.ieee.org
CMOS-compatible Tungsten heaters for silicon photonic waveguides Page 1 CMOS-comp
Silicon A. Masood1, M. Pantouvaki2, D. 1 Photonics Research Group (INT Center for Nano and …
Silicon A. Masood1, M. Pantouvaki2, D. 1 Photonics Research Group (INT Center for Nano and …
3D silicon photonics packaging based on TSV interposer for high density on-board optics module
A 3D silicon photonics packaging architecture based on a Cu-metallized Si-photonics
through-silicon-via (TSV) interposer has been designed and experimentally demonstrated …
through-silicon-via (TSV) interposer has been designed and experimentally demonstrated …
Through-Si-via (TSV) keep-out-zone (KOZ) in SOI photonics interposer: A study of the impact of TSV-induced stress on Si ring resonators
Si photonic devices are sensitive to the change in refractive index on the Si-on-insulator
(SOI) platform. One of the critical limitations in the compact 3D photonic integration circuit is …
(SOI) platform. One of the critical limitations in the compact 3D photonic integration circuit is …
3D electro-optical integration based on high-performance Si photonics TSV interposer
Abstract 3D electro-optical integration based on a Cu-based Si-photonics TSV interposer
has been demonstrated for integrated optical communication applications. The photonics …
has been demonstrated for integrated optical communication applications. The photonics …
Silicon photonic memory interconnect for many-core architectures
A scalable and flexible memory interconnect is a key component for a many-core
architecture to take full advantage of the high-bandwidth of multiple memory stacks. In this …
architecture to take full advantage of the high-bandwidth of multiple memory stacks. In this …
Development of 3D electro-optical integration based on silicon photonic TSV interposer
Y Yang - 2016 - dr.ntu.edu.sg
Silicon photonics has been intensively researched and investigated as it provides a low-cost
and power efficient solution for next generation interconnect technology based on on-chip …
and power efficient solution for next generation interconnect technology based on on-chip …
Core Switching Noise for On-Chip 3D Power Distribution Networks
W Ahmad - 2012 - diva-portal.org
Reducing the interconnect size with each technology node and increasing speed with each
generation increases IR-drop and Ldi/dt noise. In addition to this, the drive for more …
generation increases IR-drop and Ldi/dt noise. In addition to this, the drive for more …