Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …

As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

Abstract Recently, the Sn–Zn family of alloys, which possesses many attractive advantages
such as relatively low melting point, cheap cost and the environmentally friendly component …

Abstract Eutectic Sn–Bi alloy is acquiring significant observation in the electronic packaging
industry because of its advantageous properties such as ductility, low melting temperature …

Nanoparticle reinforced lead-free solder has previously been studied by several
investigators, but few studies have evaluated its reliability. In this study, resistor chip (RC) …

Abstract Eutectic Sn-Zn alloy is considered as one of the best lead free solder alloys in
microelectronic industry. That motivates our group to select different weight percentage of …

Abstract As-cast Sn-8.8 wt.% Zn eutectic alloy was directionally solidified with a constant
temperature gradient (G= 4.16 K/mm) under various solidification rates (V= 8.3–790 μm/s) in …

Abstract Mechanical properties of Sn-0.7 wt.% Cu lead-free solder alloy reinforced with 0
vol.%, 1 vol.%, 2 vol.%, and 3 vol.% 100-nm SiC particles have been assessed using the …