The sub-micron void called “Kirkendall void” has been widely observed within intermetallic
compound (IMC) layers in solder joints of semiconductor package interconnections that …

Abstract In total, 0.5 wt% CuZnAl memory particles with the diameters (2–6 μm) were added
into Sn–58Bi solder in order to enhance the properties of solder joints in electronic …

This article is focused on both macro and microvoids in soldered joints and the use of
additional flux to reduce their frequency and minimize their negative effect on the soldered …

For low cost high efficiency fully plated NiCu contacts on silicon solar cells, a thermal
formation of nickel silicide is commonly performed for adhesion promotion. Since the results …

Synthesis of colloidal nanocrystals (NCs), which are not readily available via the wet-
chemical approach based on arrested precipitation, has often relied on templated growth …

Copper plating can provide significant cost savings over screen printed Ag for industrially
produced Si photovoltaic modules, however concerns exist with regard to the durability of …

The reliability of flip-chip Sn/Cu solder joint strongly depends on Kirkendall voids, since it
affects the mechanical properties of the solder joints. In this paper, the formation of …

This study aims to investigate the shear and tensile impact strength of solder ball
attachments. Tests were conducted on Ni-doped and non-Ni-doped Sn–0.7 wt.% Cu, Sn …

An important phenomenon of Kirkendall effect is the presence of voids that formed during
diffusion, which may crack the mechanical properties. In this paper, a cellular automaton …

This study aims to comprehensively elucidate the microscopic origins of damage in eutectic
SnPb alloy through atomic-scale investigations, a crucial endeavor for enhancing the alloy's …