This study reviews soft errors in modern electronic assemblies, through silicon via (TSV),
and low α-solder bumping techniques for 3-D microelectronic packaging. The TSV …

Lateral thermoelectric devices, where the Peltier cooling and heating occur in a lateral
direction, have shown promise for thermal management of on-chip hot spots, and because …

This letter reports for the first time the fabrication and characterization of through-silicon vias
(TSVs) using air-gap insulators to enable high-performance 3-D integration. To address the …

Through-silicon vias (TSVs) using benzocyclobutene (BCB)-liners as the insulator have the
potential for reducing the TSV capacitances and the thermal expansion stresses. This paper …

This paper provides a new approach for the formation of polymer liner for low-k high-aspect-
ratio through-silicon-vias involved in via-last backside-via 3-D integration applications. The …

Through silicon vias (TSV) are the enabling components in the emerging 2.5 D and 3D
integration microelectronic packaging. The insulation layer, ie the liner, plays the key role in …

Low-k and high aspect ratio blind through-silicon-vias (TSVs) to be applied in “via-
last/backside via” 3-D integration paradigm were fabricated with polyimide dielectric liners …

This paper presents design, fabrication, and high-frequency characterization of through-
silicon-vias (TSVs) with benzocyclobutene (BCB) as the dielectric liner to exploit its low …

Due to the advantages of ease of fabrication, low cost, and potential high reliability, through-
silicon-vias (TSVs) using low-resistivity silicon posts as conductors and circular polymer …

Through-silicon vias (TSVs) with air gaps as the isolators have been developed to reduce
the TSV capacitance and to solve the reliability problems associated with thermomechanical …