LED technology has been evolving aggressively in recent years from incandescent bulb
during older days to as small as chip scale package. There is tremendous pressure to stay …

During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …

One of foremost issue arise in the dam management and dam reliability assessment is the
sedimentation of suspended particles. Sedimentation affected the energy production and …

Recent advances in the micro-electronics industry have increased the demand for smaller
and more compact package devices with higher performance. This paper presents an …

This paper detailed the particle image velocimetry (PIV) experimental work in the study of
vortex flow in the penstock section. The scaled-down physical model for the penstock pipe …

Dam failure is undeniably catastrophic and one of its major causes is the soil erosion near
the dam structure. In this paper, the characteristics and compositions of soil sediment in dam …

The formation of vortex and swirling in any flow structures of the hydropower dam is
undesirable, as it reduced the performance of turbine as well as lowered the efficiency of …

In the conventional flip-chip underfill encapsulation process, the underfill fluid is driven into
the gap beneath the chip and substrate through capillary action. Particularly, the capillary …