Microwave resonators for wearable sensors design: a systematic review

I Royo, R Fernández-García, I Gil - Sensors, 2023 - mdpi.com
The field of flexible electronics is undergoing an exponential evolution due to the demand of
the industry for wearable devices, wireless communication devices and networks …

Self-sustainable biomedical devices powered by RF energy: A review

H Yahya Alkhalaf, M Yazed Ahmad, H Ramiah - Sensors, 2022 - mdpi.com
Wearable and implantable medical devices (IMDs) have come a long way in the past few
decades and have contributed to the development of many personalized health monitoring …

Broadband and miniaturized antenna-in-package (AiP) design for 5G applications

TH Lin, K Kanno, AO Watanabe, PM Raj… - IEEE Antennas and …, 2020 - ieeexplore.ieee.org
A broadband and miniaturized planar Yagi antenna-in-package (AiP) design for the fifth-
generation (5G) wireless communication is proposed. The monopole taper radiator is …

Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications

A Eid, X He, R Bahr, TH Lin, Y Cui… - IEEE Microwave …, 2020 - ieeexplore.ieee.org
With the revolutionary developments in the fields of millimeter-wave (mm-wave) and Internet
of Things (IoT) technologies and the billion devices promised to be implemented by the end …

Novel 3D-printed reconfigurable origami frequency selective surfaces with flexible inkjet-printed conductor traces

Y Cui, SA Nauroze, MM Tentzeris - 2019 IEEE MTT-S …, 2019 - ieeexplore.ieee.org
This work outlines the first-of-its-kind integration of 3D and inkjet printing additive
manufacturing processes for the realization of tunable origami structures. The outcome of …

Achieving fully autonomous system-on-package designs: An embedded-on-package 5G energy harvester within 3D printed multilayer flexible packaging structures

TH Lin, SN Daskalakis, A Georgiadis… - 2019 IEEE MTT-S …, 2019 - ieeexplore.ieee.org
A novel multilayer flexible packaging fabrication process using only additively manufacturing
techniques including inkjet and 3 dimensional (3D) printing is proposed. The 3D printed …

Innovative packaging solutions of 3D system in package with antenna integration for IoT and 5G application

M Tsai, R Chiu, E He, JY Chen, R Chen… - 2018 IEEE 20th …, 2018 - ieeexplore.ieee.org
In the near future, the next potential fast and large growing opportunity market will be the
Internet of Things (IoT) and fifth generation (5G) connectivity application, due to the …

Additively manufactured “smart” rf/mm-wave packaging structures: A quantum leap for on-demand customizable integrated 5g and internet of things modules

X He, K Hu, Y Cui, R Bahr, B Tehrani… - IEEE Microwave …, 2022 - ieeexplore.ieee.org
5G and Internet of Things (IoT) technologies are rapidly expanding fields, utilizing cutting
edge processes and manufacturing techniques that enable wide connectivity coverage and …

A flexible antenna on cost-effective PEN substrate for sub-6 GHz 5G wireless transceivers

F Tariq, Q Amjad, A Kamran, A Hassan… - … on Frontiers of …, 2019 - ieeexplore.ieee.org
In order to realize the dream of high-performance, low-cost, low-power, low-loss, and low-
profile wireless transceivers for the emerging 5th generation (5G) technology, there is a dire …

Inkjet-Printed Reflectarray Antenna Integrating Feed and Aperture on a Flexible Substrate Using Origami Techniques

YX Lin, KY Ko, FP Lai, YS Chen - Electronics, 2024 - mdpi.com
This paper presents an innovative method for fabricating reflectarray antennas using inkjet
printing technology on flexible substrates, markedly enhancing integration and …