The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …

This review summarises the research work carried out in the field of carbon nanotube (CNT)
metal matrix composites (MMCs). Much research has been undertaken in utilising CNTs as …

This discovery of carbon nanotubes (CNT) three decades ago ushered in the technological
era of nanotechnology. Among the most widely studied areas of CNT research is their use …

This work investigates the effects of nano-Al2O3 on the microstructure and microhardness of
the Sn3. 5Ag0. 5Cu composite solder alloy. In comparison with solder without the addition of …

Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Recently, nano-composite solders have been developed in the electronic packaging
materials industry to improve the creep and thermo-mechanical fatigue resistance of solder …

Varying weight fractions of graphene nanosheets were successfully incorporated into lead-
free solder using the powder metallurgy route. The effects of graphene nanosheets on the …

For development of a lead-free composite solder for advance electrical components, a
series of Sn3. 5Ag0. 25Cu (SAC) solders containing TiO2 nanopowders have been studied …

The effects of TiO 2 nanoparticles addition on the microstructure, microhardness, and tensile
properties of Sn–3.0 wt.% Ag–0.5 wt.% Cu–x wt.% TiO 2 (x= 0, 0.05, 0.1, and 0.6) composite …

Sn–3.8 Ag–0.7 Cu-based composite solders functionalized with single-wall carbon
nanotubes (SWCNTs) with various weight proportions ranging from 0.01 to 1wt% were …