[PDF][PDF] Deposition and application of electroless Ni–W–P under bump metallisation for high temperature lead-free solder interconnects
L Liu - 2016 - core.ac.uk
ABSTRACT A reliable and robust diffusion barrier, commonly known as under bump
metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial …
metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial …