Lead free solder alloys for electronic assembly is being driven by environmental and health
concerns regarding toxicity of lead and, more importantly, by the perceived economic …

The effects of Cu and Ni additions on the wettability and interfacial reaction of Sn–Ag solder
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …

The effect of Sb contents (0–10wt%) on the reliability of Sn–Ag–Sb solder has been
investigated with isothermal low cycle mechanical fatigue tests. The solders tested were Sn …

This study investigates composite lead-free solders fabricated by adding between 0.5 and
3wt% of Ni particles in situ to Sn–3.5 wt% Ag lead-free solder. The single lap shear strength …

The lead-free Sn–1.7 Sb–1.5 Ag solder alloy and the same material reinforced with 5vol.%
of 0.3-μm Al2O3 particles were synthesized using the powder-metallurgy route of blending …

In this work, SnBiAg-xSb solder alloys (where x= 0, 0.5 wt.%, 1.0 wt.%, 1.5 wt.%, 2.0 wt.%,
and 2.5 wt.%) were prepared by compression and annealing treatment following water …

To obtain Sn-3.0 Ag-0.5 Cu-x Sb (x= 0, 25, 28, and 31) high-temperature lead-free solder
antimony was added to Sn-3.0 Ag-0.5 Cu solder. The microstructure, thermal properties, and …

The density and the surface tension of binary Sn–Sb and ternary Sn–Sb–Cu liquid alloys
have been measured over a wide temperature range by the sessile-drop method. The …

This study forms composite solders by adding 0.5–3wt% of Ni particles in situ to Sn–3.5 wt%
Ag lead-free solder. Cu/solder/Cu specimens are prepared by dipping two Cu rods into a …

In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0
Ag-0.5 Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and …