In a multi-chip module (MCM), a “super chip (110N) is attached to multiple “plain” chips
(110F:“super” and “plain chips can be any chips). The Super chip is positioned above the …

(57) ABSTRACT A method for making an interposer includes forming a plurality of wire
bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is …

An image sensor device, as well as methods therefor, is disclosed. This image sensor
device includes a substrate having bond pads. The substrate has a through substrate …

A structure may include bond elements having bases joined to (51) Int. Cl. conductive
elements at a first portion of a first Surface and end HOIL 23/02(2006.01) surfaces remote …

A device and method of forming the device that includes cavities formed in a substrate of a
substrate device, the substrate device also including conductive vias formed in the substrate …

(57) ABSTRACT A method of making a microelectronic package includes forming a
dielectric encapsulation layer on an in-process unit having a substrate having a first Surface …

A semiconductor device and method for forming the semiconductor device is provided. The
semiconductor device includes an integrated circuit having through vias adjacent to the …

Methods of forming a back side image sensor device, as well as back side image sensor
devices formed, are disclosed. In one such a method, an image sensor wafer having a first …

(57) ABSTRACT A combined interposer (120) includes multiple constituent interposers (120.
i), each with its own substrate (120. iS) and with a circuit layer (eg redistribution layer) on top …

(57) ABSTRACT A microelectronic package can include wire bonds having bases bonded to
respective ones of conductive elements exposed at a surface of a substrate. The wire bonds …