With degradation in transistors dimensions and complication of circuits, Three-Dimensional
Network-on-Chip (3-D NoC) is presented as a promising solution in electronic industry. By …

Future many-core systems need to handle high power density and chip temperature
effectively. Some cores in many-core systems need to be turned off or 'dark'to manage chip …

Hybrid Wireless Network-on-Chip (HWNoC) provides high bandwidth, low latency and
flexible topology configurations, making this emerging technology a scalable communication …

Most of the cores in future many-core system-on-chip (MCSoC) will be off ordark'to manage
the high power density and chip temperature of future chips. This problem is called dark …

As an effective scheme often adopted for performance tuning in many-core processors, task
migration provides an opportunity for “hot” tasks to be migrated to run on a “cool” core that …

The continuous scaling of silicon technology has enabled many-core systems to become
ubiquitous, offering enormous computational power for various applications spanning from …

In a modern many-core chip, as all the cores are constantly competing for their shares of
power out of the maximum power available to the chip, a sound power budgeting scheme is …

The ever-increasing computational demand drives modern electronic devices to integrate
more processing elements for pursuing higher computing performance. However, the …

In spite of escalating thermal challenges imposed by high power consumption, most
reported 3D Network-on-chip (NoC) systems that adopt classic 3D cube (mesh) topology are …

Future many-core systems need to address the dark silicon problem, where some cores
would be turned off to control the chip's thermal and power density, which effectively limits …