For electronics, poor thermal management could cause severe mechanical and electrical
failures. Forced convective air cooling, ie, flowing air over a hot surface, is one of the most …

Additive manufacturing (AM) techniques have by far been utilized to make 3-D passive
components (ie, resistors, inductors, and capacitors), circuit boards, and packages of power …

In this paper, the thermal characteristics of three modifications of a gravity heat pipe with a
threaded evaporator (cylindrical, semi-flattened, and flattened) under natural convection …

To meet the upcoming challenges of higher power density and higher efficiency for power
electronics, a system level approach to the design of power electronic devices must be …

Over the last few decades, there has been an increasing interest in manufacturing complex
three-dimensional (3D) structures for theoretical models. This has escalated the research in …

There has been a growing demand for novel, highly efficient, power-saving cooling solutions
in recent years. In many cases, standard cooling techniques offer only limited opportunities …

The emerging wide bandgap (WBG) semiconductor devices have been developed for power
conversion applications instead of silicon devices due to higher switching frequencies (from …

The ever-increasing demand on reliable cooling of devices are increasing with the
advancements in technology, while the dependency on such devices is in the incline. Heat …

I am originally from the small island Texel in the north of the Netherlands. I am an
adventurous and sportive young engineer with a compelling drive to understand the way …