Abstract The Cu 40 Al 60 alloy has been developed as the precursor alloy to fabricate
nanoporous copper (NPC) sheets through chemical dealloying in 1.6 mol/L dilute …

Driving by the increased demand for hermetic packaging in the more than Moore (MtM)
roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed …

The continuous trend to integrate more multi-functions in a package often involves,
Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The …

Conventional microelectronic interconnections are made using solder alloys, but the
demand for high performance interconnects is ever-increasing to meet challenges of …

With the increasing application of wide bandgap materials such as silicon carbide and
gallium nitride in power devices, the working temperature of power devices has been …

Flip-chip interconnects made of silver are promising candidates to overcome the intrinsic
limits of solder-based interconnects and match the demand for increased current densities of …

Advances in semiconductor device manufacturing technologies are enabled by the
development and application of novel materials. Especially one class of materials …

针对VLSI 中的互连线信号完整性问题, 研究温度和频率对电阻, 电感和电容的影响.
在温度和频率的作用下, 采用多节RLC 模型, 分别探讨温度和频率对互连线电学特性的影响 …

The joining materials for high-temperature electronics must survive in very severe thermal
environments that are not usually experienced by conventional Si devices [1]. The joint must …

We report the design, fabrication and experimental investigation of a MEMS micro-hotplate
(MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste …