Evaporation of liquid is important in a diverse range of engineering applications, such as ink-
jet printing, pesticide spraying, micro-and nanofabrication, thin-film coatings, biochemical …

Using microfluidic cooling to achieve thermal management of three-dimensional integrated
circuits (ICs) is recognized as a promising method of extending Moore law progression in …

System-on-Chip (SoC) complexity and the increasing costs of silicon motivate the breaking
of an SoC into smaller" chiplets." A chiplet-based SoC design process has the promise to …

This work proposes a case-embedded cooling (CECool) for microwave multi-chip module
and theoretically studies its cooling capacity based on an improved analytical model. In this …

Recent application and technology trends bring a renaissance of the processing-in-memory
(PIM), which was envisioned decades ago. In particular, die-stacking and silicon interposer …

In this article, we propose an embedded cooling structure with thermal transmission line
(ECS-TTL) to improve thermal integrity (TI) and signal integrity (SI) of a high-bandwidth …

With the rising demand for data centers, the need for an efficient thermal management
approach becomes increasingly critical. This study examines the enhancement in pool …

In this paper, 2.5-D integrated circuits (ICs) using bridge-chip technology are thermally
evaluated to investigate thermal challenges and opportunities for such multi-die packages …

Thermal management poses a critical challenge in the design of modern electronic
packages. This letter presents a diamond-on-chip-on-glass interposer (DoCoG) technology …

Thermal integrity is known to be one of the most challenging barriers in the development of
2.5-D/3-D integrated packaging systems. In this work, an embedded microchannel heatsink …