One of the most significant challenges for the fabrication of any microelectro-mechanical-
system (MEMS) device is the low cost and high throughput packaging of the device to …

This paper describes techniques for the miniaturized, low-cost wafer level chip-scale
packaging of MEMS based system in packages (SiPs). The approaches comprise …

This article presented the possibilities of making microwave and mm-wave ICs more
intelligent through a combination of established Si/SiGe BiCMOS technologies, which allow …

This chapter presents an introduction to radio frequency microelectromechanical systems
(RF MEMS) technologies for wireless applications. It starts with reviewing the operation …

This manuscript describes process scenarios for advanced wafer level packaging which are
enabled by temporary bonding and de-bonding capabilities but exceeding the skills of …

An accurate and very large band (30–110 GHZ) lumped element equivalent circuit model of
capacitive RF-MEMS components based on a standard 250 nm BiCMOS technology is …

An accurate and very large band (30–110GHZ) lumped element equivalent circuit of
capacitive RF-MEMS components based on a standard 250nm BiCMOS technology is …

Wireless communication technologies have continuously advanced for both performance
and frequency aspects, mainly for the frequencies up to 6 GHz. The results of Moore's law …

This paper presents a method which allows the prediction of the RF performance of
capacitive RF-MEMS by measuring the UP and DOWN state capacitances. The method is …

In the last decade, silicon germanium (SiGe) bipolar complementary metal oxide
semiconductor (BiCMOS) technologies opened a new cost-efficient market for the mm-wave …