Embodiments herein describe disposing a waveguide adapter onto an SOI device after the
components on a silicon surface layer have been formed. That is, the waveguide adapter is …

The embodiments herein describe a photonic chip (formed from a SOI structure) which
includes an optical interface for coupling the optical components in the photonic chip to an …

Aspects disclosed herein include providing a photonic chip that includes an unetched side
surface formed by a dicing process performed on a semiconductor wafer, and first edge …

An optical coupler comprises a waveguide structure including a first waveguide layer having
a proximal end and a distal end, the first waveguide layer including a first pair of waveguides …

In an example, an optical coupler includes a waveguide structure. The waveguide structure
includes a waveguide layer having a proximal end and a distal end. The waveguide layer …

Embodiments herein describe using a double wafer bonding process to form a photonic
device. In one embodiment, during the bonding process, an optical element (eg, a high …

(57) ABSTRACT A method of manufacturing an optical apparatus comprises forming an
unfinished endface of a fiber array unit (FAU) that provides an arrangement of one or more …

Embodiments disclosed herein generally relate to optical coupling between a highly-
confined waveguide region and a low confined waveguide region in an optical device. The …