System Considerations for Large Copper Wire and Ribbon Bonding in Mass Production

Research on Reliability of Heavy Copper Wire Bonding for IGBT Module

Y Chen, J Fang, H Zhao - PCIM Asia 2024; International …, 2024 - ieeexplore.ieee.org
In the advanced application of power electronic modules, the design and manufacture of
power modules must meet the requirements of high frequency switching rate, high power …
相关文章