The current key issues in applying acoustofluidics in engineering lie in the inflexibility of
manufacturing processes, particularly those involving modifications to piezoelectric …

This study investigated the effectiveness of heat shield placement locations during the
rework process to avoid thermal and mechanical damage to adjacent ball grid array …

Approaches such as the modification of substrate design and the use of different types of
underfill/epoxy mold compound were proposed to solve the delamination problem in system …

This research pioneers the application of artificial intelligence (AI) methodologies—machine
learning, deep learning, hybrid models, transfer learning, and edge AI deployment—in …

The technique of embedding components inside printed circuit boards (PCBs) is described,
using different filling masses. To investigate the possibility of placing the components inside …

An exploratory work involving waste printed wiring board (WPWB)–derived inexpensive
silver oxide (Ag2O)–grafted silica-alumina composite photocatalyst (SAA) using quartz …

Temperatures for hot air and laser reflow soldering were evaluated for a ball grid array
component (BGA) throughout the rework procedure to mitigate the influence of mechanical …

Correlation between adjacent ball grid array (BGA) components' temperature and thermal-
induced damage to their solder joints on both the top and bottom printed circuit board …

The problem of delamination in system-in-package devices was studied. It was found that
this type of failure was induced by solder flux excess trapped underneath electronic …

The article describes the study of the strength of solders in LGA (Land grid array) assembly.
The influence of the design of the pads of the boards on the strength of the solders is …