Nanometric cutting removes material at nanoscale and generates high-quality surfaces with
a nanometric finish. In past decades, it has thrived as a mainstream manufacturing …

Ultra-precision diamond cutting is a promising machining technique for realizing ultra-
smooth surface of different kinds of materials. While fundamental understanding of the …

Silicon carbide (SiC) materials are widely applied in the field of nuclear materials and
semiconductor materials due to their excellent radiation resistance, thermal conductivity …

Molecular dynamics (MD) simulations have become a pivotal tool in the nanofabrication of
semiconductor materials, a key area of contemporary semiconductor process research. This …

In this paper, molecular dynamics simulations were performed to simulate ion implantation
and diamond grinding processes of SiC. Moreover, workpiece surface roughness was …

Silicon carbide (SiC) is an attractive material for many industrial applications, such as
semiconductors, electronic power devices, and optical and mechanical devices, owing to its …

Nano-scratching is an indispensable approach for investigating the ductile deformation and
subsurface defects produced during nano-machining of hard, brittle material. In this study …

Highly-oriented 3C-SiC possesses good out-of-plane orientation uniformity, and has more
potential to obtain uniform surface quality during ultra-precision machining, compared with …

Optical-grade surfaces can be manufactured on metals and ceramics through precise
control of diamond cutting tools in ultra-precision machining and traditional optimization of …

Silicon carbide (β-SiC) polishing aims to maximize material removal rate and surface quality.
Molecular dynamics (MD) simulations revealed β-SiC substrate removal methods with …