A review on numerical approach of reflow soldering process for copper pillar technology
This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …
by the semiconductor industry's demands for thinner and faster data transmission. This …
Reliability assessment in welding process of SiP with dual-chamber by finite element analysis
D Su, F Wang, L Zhang, C Wang… - 2021 22nd …, 2021 - ieeexplore.ieee.org
In this paper, a state-of-the art SiP with dual-chamber was established. The new structure
contained bumps, chips, ceramic substrate, pins and cover plates. The deformation …
contained bumps, chips, ceramic substrate, pins and cover plates. The deformation …