Mechanical deformation behavior of SAC305 at high strain rates
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys
Electronics may experience high strain rates when subjected to high g-loads of shock and
vibration. Material and damage behavior of electronic materials at high strain rates typical of …
vibration. Material and damage behavior of electronic materials at high strain rates typical of …
Stress–strain behavior of SAC305 at high strain rates
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
High temperature vibration fatigue life prediction and high strain rate material characterization of lead-free solders
G Limaye - 2013 - search.proquest.com
Current trends in the automotive industry warrant a variety of electronics for improved
control, safety, efficiency and entertainment. Many of these electronic systems like engine …
control, safety, efficiency and entertainment. Many of these electronic systems like engine …
Effect of isothermal aging and high strain rate on material properties of innolot
P Lall, G Limaye, S Shantaram… - International …, 2013 - asmedigitalcollection.asme.org
Industry migration to lead-free solders has resulted in a proliferation of a wide variety of
solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn …
solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn …
High strain-rate mechanical properties of SnAgCu leadfree alloys
Electronic products are subjected to high G-levels during mechanical shock and vibration.
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace …
A comparison of modeling methods for predicting the elastic-plastic response of additively manufactured honeycomb structures
Valid and accurate models describing the mechanical behavior of additively manufactured
cellular materials are crucial to enabling their implementation in critical-to-function parts …
cellular materials are crucial to enabling their implementation in critical-to-function parts …
A maximum entropy fracture model for low and high strain-rate fracture in TinSilverCopper alloys
DK Chan - 2012 - search.proquest.com
SnAgCu solder alloys exhibit significant rate-dependent constitutive behavior. Solder joints
made of these alloys exhibit failure modes that are also rate-dependent. Solder joints are an …
made of these alloys exhibit failure modes that are also rate-dependent. Solder joints are an …
Mechanical Behavior of Lead-Free Solder at High Temperatures and High Strain Rates
X Long, T Su, C Chang, J Huang… - 2021 22nd …, 2021 - ieeexplore.ieee.org
While moving ahead with science and technology., the service conditions of microelectronic
devices are becoming more and more complicated., and the performance requirements of …
devices are becoming more and more complicated., and the performance requirements of …