In one embodiment, a ruggedized wafer level microelectro mechanical (“MEMS”) force
sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane …

Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including
both piezoresistive and piezoelectric sensing elements and integrated with comple mentary …

Described herein is a ruggedized microelectromechanical (“MEMS”) sensor including both
fingerprint and force sensing elements and integrated with complementary metal-oxide …

Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The
sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the …

MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are
described herein. An example MEMS force sensor can include a TCO compensation layer to …

A vibration sensor for a fluid environment includes a vibrissa that can be positioned in the
fluid environment. The vibrissa is joined to a cantilever body having magnets positioned …

Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including
both piezoresistive and piezoelectric sensing elements and integrated with complementary …

4, 842685 4,849,730 49 14624 49 18.262 4933660 4,983,786 5095401 5,159,159 5,
166612 5,237,879 5,291,795 5,320,705 5,333,505 5,343.220 5,349,746 5,351,550 5 …

Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including
a sensor die and a strain transfer layer. The MEMS force sensor employs piezoresis tive or …

MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are
described herein. An example MEMS force sensor can include a TCO compensation layer to …