Review of chiplet-based design: system architecture and interconnection
Y Liu, X Li, S Yin - Science China Information Sciences, 2024 - Springer
Chiplet-based design, which breaks a system into multiple smaller dice (or “chiplets”) and
reassembles them into a new system chip through advanced packaging, has received …
reassembles them into a new system chip through advanced packaging, has received …
SPRINT: A high-performance, energy-efficient, and scalable chiplet-based accelerator with photonic interconnects for CNN inference
Chiplet-based convolution neural network (CNN) accelerators have emerged as a promising
solution to provide substantial processing power and on-chip memory capacity for CNN …
solution to provide substantial processing power and on-chip memory capacity for CNN …
TAP-2.5 D: A thermally-aware chiplet placement methodology for 2.5 D systems
Y Ma, L Delshadtehrani, C Demirkiran… - … , Automation & Test …, 2021 - ieeexplore.ieee.org
Heterogeneous systems are commonly used today to sustain the historic benefits we have
achieved through technology scaling. 2.5 D integration technology provides a cost-effective …
achieved through technology scaling. 2.5 D integration technology provides a cost-effective …
HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement
2.5 D integration is an important technique to tackle the growing cost of manufacturing chips
in advanced technology nodes. This poses the challenge of providing high-performance …
in advanced technology nodes. This poses the challenge of providing high-performance …
An Electrical–Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems
X Ma, Q Xu, C Wang, H Cao, J Liu… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Chiplet heterogeneous integration (CHI) is one of the important technology choices to
continue Moore's law. However, due to the characteristics of high power and low supply …
continue Moore's law. However, due to the characteristics of high power and low supply …
The Survey of Chiplet-based Integrated Architecture: An EDA perspective
Enhancing performance while reducing costs is the fundamental design philosophy of
integrated circuits (ICs). With advancements in packaging technology, interposer-based …
integrated circuits (ICs). With advancements in packaging technology, interposer-based …
Architecting optically controlled phase change memory
Phase Change Memory (PCM) is an attractive candidate for main memory, as it offers non-
volatility and zero leakage power while providing higher cell densities, longer data retention …
volatility and zero leakage power while providing higher cell densities, longer data retention …
Cost-aware exploration for chiplet-based architecture with advanced packaging technologies
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via
various inter-chiplet connection and heterogeneous integration. However, it is not known …
various inter-chiplet connection and heterogeneous integration. However, it is not known …
Fast thermal analysis for chiplet design based on graph convolution networks
2.5 D chiplet-based technology promises an efficient integration technique for advanced
designs with more functionality and higher performance. Temperature and related thermal …
designs with more functionality and higher performance. Temperature and related thermal …
Trade-off-oriented impedance optimization of chiplet-based 2.5-D integrated circuits with a hybrid MDP algorithm for noise elimination
Interposer and chiplet-based 2.5-D integrated circuit (IC) designs have become a new trend
for block-level heterogeneous integration. In this paper, a new hybrid metaheuristic …
for block-level heterogeneous integration. In this paper, a new hybrid metaheuristic …