[图书][B] An analytical and experimental investigation of filament formation in glass/epoxy composites
KL Rogers - 2005 - search.proquest.com
The drive to increase circuit density with smaller PWB geometries and higher layer counts in
multi-layer boards along with the increasing use of electronics in harsh environments for …
multi-layer boards along with the increasing use of electronics in harsh environments for …
Effects of curing agents and drilling methods on CAF formation in halogen-free laminates
LS Chan - 2012 - uwspace.uwaterloo.ca
Increasing demands for more reliability and functionalities in electronic devices have
pushed the electronics industry to adopt newly developed materials and reduce interconnect …
pushed the electronics industry to adopt newly developed materials and reduce interconnect …
Failure Localization of Intermittent Short Failures Caused by Vertical Conductive Anodic Filament Formation
D Nuez, P Tan - … Symposium for Testing and Failure Analysis, 2014 - dl.asminternational.org
Conductive anodic filament (CAF) formation is a mechanism caused by an electrochemical
migration of metals from a metal trace in ICs or in PCBs. This is commonly caused by the …
migration of metals from a metal trace in ICs or in PCBs. This is commonly caused by the …
Laser structuring of ultra-fine circuit lines in printed circuit boards
B Zhang - 2007 - theses.lib.polyu.edu.hk
Laser structuring technique emerged in recent years for the need of fabricating fine circuit
lines and spaces in printed circuit board. Most of the previous work only introduced laser …
lines and spaces in printed circuit board. Most of the previous work only introduced laser …