A systematic analysis of power saving techniques for wireless network-on-chip architectures

F Yazdanpanah, R Afsharmazayejani - Journal of Systems Architecture, 2022 - Elsevier
Wireless network-on-chip (WNoC, aka WiNoC) architectures, as an emerging and viable
alternative approach, overcome the communication constraints and drawbacks of network …

A low-power wnoc transceiver with a novel energy consumption management scheme for dependable iot systems

F Yazdanpanah - Journal of Parallel and Distributed Computing, 2023 - Elsevier
Wireless network-on-chip architectures (WNoCs), by combining wired and wireless modules
and links, provide fast and efficient communication infrastructures for complex on-chip …

High-performance logic-on-memory monolithic 3-D IC designs for arm Cortex-A processors

L Zhu, L Bamberg, SSK Pentapati… - … Transactions on Very …, 2021 - ieeexplore.ieee.org
Monolithic 3-D IC (M3-D) is a promising solution to improve the performance and energy-
efficiency of modern processors. But, designers are faced with challenges in design tools …

Asymmetric crosstalk harnessed signaling for large 3D routing integration

D Iparraguirre, JG Delgado-Frías - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
This brief presents a high level of integration for parallel source-synchronous interfaces
using Asymmetric Crosstalk Harnessed Signaling (ACHS) on 3D routing environments …

Parasitic Effects Analysis and Equivalent Circuit Modeling of Tapered Serpentine Interconnects of On-chip FBAR up to 67GHz

X Cao, W Li, Q Cai, L Zhou… - 2024 Photonics & …, 2024 - ieeexplore.ieee.org
As an important part of the 5G communication system, millimeter-wave on-chip circuits and
systems have become a hot research area in recent years. With the rapid development of …

Advances in 3D NoC Based Multi-Core Systems Research and IO Design: Past, Present and Future A Systematic Review

BPA Rao, KA Gupta - 2021 5th International Conference on …, 2021 - ieeexplore.ieee.org
3D NoC retains the benefits of mini aturisation while offering a scalable channel for multi-
core structures. For 3D Integration, homogeneous ones have historically been used …

Design of a Transmitter for Inductively-Coupled High-Bitrate Communication in Stacked Chips

G Gonçalves, FL Cabrera - … on Circuits and Systems II: Express …, 2021 - ieeexplore.ieee.org
The design of a circuit to transmit contactless data between two stacked chips is presented
in this brief. The communication is performed through magnetic coupling of a pair of …