Multi-stack package-on-package structures
CH Yu, AJ Su - US Patent 10,784,248, 2020 - Google Patents
A package includes a first device die, and a first encapsu lating material encapsulating the
first device die therein. A bottom surface of the first device die is coplanar with a bottom …
first device die therein. A bottom surface of the first device die is coplanar with a bottom …
Multi-stack package-on-package structures
CH Yu, AJ Su - US Patent 10,490,540, 2019 - Google Patents
A package includes a first device die, and a first encapsu lating material encapsulating the
first device die therein. A bottom surface of the first device die is coplanar with a bottom …
first device die therein. A bottom surface of the first device die is coplanar with a bottom …
Semiconductor device including vertically integrated groups of semiconductor packages
Y Liu, CT Chiu, Z Ji, S Dong, Z Zhou - US Patent 10,236,276, 2019 - Google Patents
(57) ABSTRACT A semiconductor device is disclosed including at least first and second
vertically stacked and interconnected groups of semiconductor packages. The first and …
vertically stacked and interconnected groups of semiconductor packages. The first and …
Semiconductor device including interconnected package on package
CT Chiu, H Takiar - US Patent 10,242,965, 2019 - Google Patents
ABSTRACT A semiconductor device is disclosed including at least first and second vertically
stacked and interconnected semicon ductor packages. Signal communication between the …
stacked and interconnected semicon ductor packages. Signal communication between the …
Thermal management of molded packages
F Eid, NN Abazarnia, JM Swan, TD Beasley… - US Patent …, 2019 - Google Patents
An embodiment includes an apparatus comprising: a semi conductor die; package molding
that is molded onto and conformal with a first die surface of the semiconductor die and at …
that is molded onto and conformal with a first die surface of the semiconductor die and at …
Thermal management in integrated circuit packages
F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent …, 2023 - Google Patents
US11784108B2 - Thermal management in integrated circuit packages - Google Patents
US11784108B2 - Thermal management in integrated circuit packages - Google Patents …
US11784108B2 - Thermal management in integrated circuit packages - Google Patents …
Bump integrated thermoelectric cooler
K Lofgreen, CM Jha, KV Valavala - US Patent 11,658,095, 2023 - Google Patents
Thermal management in integrated circuit (IC) packaging containing single or multiple
integrated circuits (ICs) is becoming an increasingly important issue. Packaging for modern …
integrated circuits (ICs) is becoming an increasingly important issue. Packaging for modern …
Thermal management in integrated circuit packages
F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent App. 16 …, 2021 - Google Patents
2019-08-06 Assigned to INTEL CORPORATION reassignment INTEL CORPORATION
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …
Manufacturing method of package structure
YC Chuang, KT Lin, L Fang, C Chia-Jen - US Patent 9,831,219, 2017 - Google Patents
A manufacturing method of a package structure includes at least the following steps. At least
one first die is disposed over a carrier. The first die is encapsulated using a first encapsulant …
one first die is disposed over a carrier. The first die is encapsulated using a first encapsulant …
Thermal management in integrated circuit packages
F Eid, T Kamgaing, G Dogiamis, A Aleksov… - US Patent …, 2023 - Google Patents
US11830787B2 - Thermal management in integrated circuit packages - Google Patents
US11830787B2 - Thermal management in integrated circuit packages - Google Patents …
US11830787B2 - Thermal management in integrated circuit packages - Google Patents …