During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

The electronic industry faces a number of issues as a result of the rapid miniaturization of
electronic products and the expansion of application areas, with the reliability of electronic …

In this study, the combined effect of GNSs (graphene nanosheets) and ENIAg (Electroless
Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) …

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless
Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and …

The rapid development of space exploration technology was intensifying the desire for lead-
free solders with high performance and reliability under extreme temperature environments …

The combination of the instantaneous large-area laser soldering process with Sn-0.7 Cu-0.2
Cr solder materials showed exceptional microstructure changes and mechanical behaviors …

Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys
(Sn-x Cu, x= 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser …

Researchers have switched their focus on advancing the exploitation of the cost-effective
pore-forming agent (PFA) fabrication method due to the capital-intensive nature of the …

This paper elucidates the influence of dimple-microtextured copper substrate on the
performance of Sn-0.7 Cu solder alloy. A dimple with a diameter of 50 µm was produced by …

In this study, the mechanical performance of the rice husk ash‐reinforced tin‐0.7 copper
composite solder was investigated. 0.01 wt.%, 0.05 wt.% and 0.1 wt.% of rice husk ash …