The reach and impact of the Internet of Things will depend on the availability of low-cost,
smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and …

This paper introduces a cost-effective, high-performance approach to achieving wafer level
vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors. Reliable and …

Although performance remains paramount, especially in defense and security applications,
cost increasingly drives the implementation strategy for existing and emerging infrared …

Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the
packaging of optical devices. It reduces global residual stress build up caused by …

A microbolometer array (MBA) is used as a detector in an infrared (IR) camera. It converts
the temperature change induced by the incoming longwave IR (LWIR) light into an electrical …

Microbolometers are the core detectors of uncooled thermal sensors. These detectors
require a high vacuum environment (< 1 Pa) to function, necessitating hermetic packaging …

Most microsensors are composed of devices and covers. Due to the complicated structure of
the cover and various other requirements, it difficult to use wafer-level packaging with such …

We have constructed a finite element simulation where we investigate the effects of wet-etch-
induced surface roughness on transmission and reflection of infrared light in the 8-12um …

In this presentation, we will review recent advances in the development of low temperature
wafer-to-wafer bonding for the fabrication of hermetic and/or vacuum enclosures for sensors …