Thermally enhanced silicon back end layers for improved thermal performance
CM Jha, P Tadayon, A Uppal, W Tang, P Diglio… - US Patent …, 2024 - Google Patents
Embodiments disclosed herein comprise a die and methods of forming a die. In an
embodiment, a die comprises, a die substrate, wherein the die substrate has a first thermal …
embodiment, a die comprises, a die substrate, wherein the die substrate has a first thermal …