Chemical vapour deposition (CVD) and atomic layer deposition (ALD) are attractive techniques for depositing a wide spectrum of thin solid film materials, for a broad spectrum of …
K Väyrynen, K Mizohata, J Räisänen… - Chemistry of …, 2017 - ACS Publications
Herein, we describe a process for the low-temperature atomic layer deposition of copper using Cu (dmap) 2 (dmap= dimethylamino-2-propoxide). The use of tertiary butyl hydrazine …
We report the formation of smooth and conformal copper seed layer for electrodeposition by atomic layer deposition (ALD) and reducing anneal of a copper nitride film. The ALD copper …
CH Winter, TJ Knisley, LC Kalutarage… - … of Inorganic and …, 2011 - Wiley Online Library
This review describes metal‐organic precursors for the growth of metal‐containing thin films by chemical vapor deposition (CVD)‐based methods. The major emphasis is on precursors …
NA Hoffman, DJH Emslie - Canadian Journal of Chemistry, 2024 - cdnsciencepub.com
The sodium aminoalkoxides Na [OCR (CF3) CH2NMeR′]{R= H, R′= Me (1a); R= R′= Me (1b); R= CF3, R′= Me (1c); R= Me, R′= Et (1d); R= CF3, R′= Et (1e)} were …
Y Xiong, GAO Hengjiao, REN Ni… - Plasma Science and …, 2018 - iopscience.iop.org
Copper thin films were deposited by plasma-enhanced atomic layer deposition at low temperature, using copper (I)-N, N'-di-sec-butylacetamidinate as a precursor and hydrogen …
Late first-row transition metals, namely copper, nickel, and cobalt, are pivotal materials in many modern and future applications. Because of its low resistivity, Cu has for long been the …
Thin films containing first-row transition metals are widely used in microelectronic, photovoltaic, catalytic, and surface-coating applications. In particular, metallic films are …