The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …

In this study, we focused on unraveling the intricate world of intermetallic compound
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …

This study delves into the intricate interaction between multi-walled carbon nanotubes
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …

This study elucidates the formation of distinct phases, such as intermetallic compounds
(IMCs), and the evolution of Kirkendall voids. We not only observed the emergence of …

The rate-controlling process of compound growth in the Cu-clad Al (CA) wire was
metallographically examined in the temperature range of 483–543 K (210–270 C). CA wires …

This study introduces research trends in the electronics materials, such as joining materials
including high-temperature lead-free solder, sintered materials using metal particles and …

Vacancy diffusion is involved in a variety of destructive failure processes in metals, whose
impact becomes more magnificent in real engineering applications with external thermal …

The growth behavior of Ni 3 Al after nucleation at the Ni/NiAl interface was investigated by
using macroscopic diffusion couples at low annealing temperatures of 973–1073 K. The …

The growth kinetics of Ni 3 Al were investigated in Ni//NiAl macroscopic diffusion couples
annealed at 800–1000° C under applied elastic compressive stress. By utilizing electron …