Metallic glasses (MGs) or amorphous alloys are an important engineering material that has
a history of research of about 80–90 years. While different fast cooling methods were …

Diamond dicing blades are profound cutting tools that find their applications in
semiconductor back-end packaging and assembly processes. To fully appreciate the …

Dicing is an important process in the making of semiconductor chips. In recent years, high
performance dicing technologies are badly needed for the new-generation wafers such as …

With the intrinsic material advantages, silicon carbide (SiC) power devices can operate at
high voltage, high switching frequency, and high temperature. However, for SiC wafers with …

In this study, an innovative fabrication method called rolling-slitting forming, which forms
ultra-thin diamond blades, was presented for the first time. Furthermore, the feasibility of the …

In this article, a CrCoNbB thin film metallic glass (TFMG) is fabricated by DC power
magnetron sputtering. Its microstructure, surface properties, mechanical properties and …

Nanomechanical properties of thin-film metallic glasses (TFMG) with various thicknesses
can be evaluated through nanoindentation experiments. In this study, zirconium based …

Mechanical dicing is a critical step in producing electronic chips and devices. Single crystal
silicon carbide (SiC) is a vital wafer material in modern electronic chips because of its …

Abstract A novel Ti–Al-Diamond metal matrix composite (MMC) material has been recently
developed for fabricating diamond blade that is an indispensable tool for the mechanical …

Due to its superior bandwidth, high thermal and electrical conductivity, single-crystal SiC is
becoming one of the most commonly employed third-generation wafer materials that are …