A review of eutectic Au-Ge solder joints
A Larsson, TA Tollefsen, OM Løvvik… - … Materials Transactions A, 2019 - Springer
Abstract Gold-germanium (Au-Ge) joints have been part of the electronics industry since the
birth of the solid state transistor. Today they find their role as a reliable joining technology …
birth of the solid state transistor. Today they find their role as a reliable joining technology …
On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint
A Larsson, KE Aamundtveit - Metallurgical and Materials Transactions A, 2020 - Springer
Joining delicate electronic components for high-temperature applications is challenging.
Regular soldering with lead-free or lead-based materials is typically not suitable for high …
Regular soldering with lead-free or lead-based materials is typically not suitable for high …
Thermal shock reliability of GaN die-attached on DBA with Ag sinter paste
The reliability of GaN/DBA die-attached joint structure with hybrid Ag paste die-attach layer
was evaluated in harsh thermal shock. For the joint structure, DBA and GaN chips metallized …
was evaluated in harsh thermal shock. For the joint structure, DBA and GaN chips metallized …
Interfacial Reactions Between ZnAl (Ge) Solders on Cu and Ni Substrates
A Rautiainen, V Vuorinen… - Journal of Electronic …, 2017 - Springer
Reactions between zinc-aluminum-germanium solder and copper/nickel substrates were
investigated after 30 min of soldering at 420° C that simulates a wafer-level bonding …
investigated after 30 min of soldering at 420° C that simulates a wafer-level bonding …