Optimization of Built-In Self-Test test chain configuration in 2.5 D Integrated Circuits Using Constrained Multi-Objective Evolutionary Algorithm
Z Yang, L Deng, C Li, L Zhang - Engineering Applications of Artificial …, 2025 - Elsevier
5 D Integrated Circuit (2.5 D IC) is an advanced packaging technology. This technology
facilitates the dense integration of multiple dies by adding passive components to the silicon …
facilitates the dense integration of multiple dies by adding passive components to the silicon …
Testing of interposer-based 2.5 D integrated circuits
R Wang, K Chakrabarty - 2016 IEEE International Test …, 2016 - ieeexplore.ieee.org
Interposer-based 2.5 D integrated circuits (ICs) are seen today as a precursor to 3D ICs
based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5 D IC must be …
based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5 D IC must be …
The hype, myths, and realities of testing 3D integrated circuits
Three-dimensional (3D) integration using through-silicon vias (TSVs) promises higher
integration levels in a single package, keeping pace with Moore's law. Despite the promise …
integration levels in a single package, keeping pace with Moore's law. Despite the promise …
Wrapper cell design and built-in self-test architecture for 3DIC test and diagnosis
A Chandra, SK Goel - US Patent 12,066,490, 2024 - Google Patents
Abstract Systems, methods, and devices are described herein for performing intra-die and
inter-die tests of one or more dies of an integrated circuit. A cell of an integrated circuit …
inter-die tests of one or more dies of an integrated circuit. A cell of an integrated circuit …
Testing of Interposer-Based 2.5 D Integrated Circuits: Challenges and Solutions
R Wang, K Chakrabarty - 2016 IEEE 25th Asian Test …, 2016 - ieeexplore.ieee.org
Interposer-based 2.5 D integrated circuits (ICs) are seen today as a precursor to 3D ICs
based on through-silicon vias. This paper describes some of the major challenges related to …
based on through-silicon vias. This paper describes some of the major challenges related to …
Carring's medium access methods in comparison to FDDI
M Wille, H Richter - IEEE Proceedings. Intelligent Vehicles …, 2005 - ieeexplore.ieee.org
Carring is a cost-effective, reliable, real-time local area network for cars that is based on a
ring topology. Applications of Carring are mechatronic systems in cars, but it is also …
ring topology. Applications of Carring are mechatronic systems in cars, but it is also …