Despite the appealing technical advantages of printed electronic (PE) technologies, there
are very few studies on their technical maturity. Conductive materials are the primary …

A 65 mn test chip to study electromigration (EM) events in integrated circuit power grids was
taped-out and successfully tested. A 9× 9 grid was implemented using M3 and M4 metal …

This paper presents the design details and control methodologies for on-chip heaters that
can provide fast and accurate local temperature control for reliability testing applications …

Electromigration (EM) is crucial to the reliability of most conductive lines used in electronics.
In the present study, the EM characteristics of inkjet-printed Ag conductive lines were …

The migration of atoms in metal interconnects in integrated circuits (ICs) increasingly
endangers chip reliability. The susceptibility of DC interconnects to electromigration has …

Material transport in liquid phase is observed when high magnitude electric field is applied
on chromium (Cr) thin films. The high electric field assist in the initiation of a chemical …

This work presents statistical data collected from 38 power grid test structures showing the
detailed impact of temperature gradient on electro migration (EM) lifetime. The failure time …

A time-to-failure (TTF) analysis of an integrated circuit due to electromigration (EM) effects is
proposed. In the TTF analysis, a wire resistance increase that results in a circuit performance …

The miniaturization of feature sizes with every technology generation in accordance with
Moore's Law coupled with the innovations in the transistor design have resulted in a …

This thesis has thoroughly summarized my six years of PhD research works in Electrical and
Computer Engineering department, University of Minnesota. The novelty and contribution of …