SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …

Abstract Eutectic Al-Ni alloys are widely faced as materials to be considered for advanced
structural components. Nevertheless, still there is a lack of research on microstructural …

Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process.
To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial …

Solder joint, crucial component in electronic systems, face significant challenges when
exposed to extreme conditions during applications. The solder joint reliability involving …

Next-generation electronic packaging strategies like heterogeneous integration packaging
necessitate low melting temperature solder alloys. The Sn-58Bi alloy is notable candidate …

Heat treatment is effective in reducing moisture absorption and improving the dimensional
stability of wood. Low point metal alloy (LMPA) is characterized by high thermal conductivity …

The corrosion behavior of Mg‐0.6% Si‐2% Zn alloys in simulated body fluid was studied to
understand the time-dependent processes and interfacial phenomena. The alloy's …

The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to
electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the …

The formation of microporosity during solidification of Sn-Bi alloys is investigated through
experiments and simulations. Samples of varying composition with 20, 30, 47 and 58 wt% Bi …

Ternary Al–15 wt% Cu–7 wt% Si and Al–22 wt% Cu–7 wt% Si alloy specimens were
generated by transient directional solidification (DS) and rapid solidification (RS) …