In one aspect of the invention, an apparatus for Supporting a Substrate is provided. In one
embodiment, an apparatus for Supporting a Substrate includes a first portion and Second …

Polishing compositions and methods for removing conduc tive materials from a substrate
surface are provided. In one aspect, a composition includes an acid based electrolyte …

Embodiments of a polishing article for processing a substrate are provided. In one
embodiment, a polishing article for processing a substrate comprises a fabric layer having a …

The invention relates to a method of polishing a substrate comprising at least one metal
layer by applying an electro chemical potential between the substrate and at least one …

Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes
a housing, a ball, a conductive adapter and a contact element. The housing has an annular …

(54) METHOD AND COMPOSITION FOR 10/032,275, filed on Dec. 21, 2001, now Pat. No.
POLISHINGA SUBSTRATE 6,899,804, application No. 11/196,876, which is a continuation …

800 plurality of grooves disposed in the polishing Surface. The article of manufacture may
be used in a processing system. The article of manufacture may be used in a method for …

Embodiments of a polishing article for polishing a substrate are provided. In one
embodiment, the polishing article includes an annular upper layer made of a dielectric …

Polishing compositions and methods for removing conduc tive materials and barrier
materials from a substrate surface are provided. Polishing compositions are provided for …

(63) Continuation-in-part of application No. 09/505,899,(57) ABSTRACT filed on Feb. 17,
2000, now Pat. No. 6,537,144, and a continuation-in-part of application No. 10/033,732 …