Hydrogen dissolved in metals as a result of internal and external hydrogen can affect the
mechanical properties of the metals, principally through the interactions between hydrogen …

Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …

We review five solder joint reactions in 3D IC packaging technology which are of wide
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …

The pursuit of greater performance in microelectronic devices has led to a shrinkage of
bump size and a significant increase in electrical current. This has resulted in a high current …

Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging
industry due to environmental concerns. Both electromigration (EM) and thermomigration …

The anisotropy of β-Sn grain is becoming the most crucial factor to dominate the
electromigration (EM) behavior with the downsizing of solder bumps. When the c-axis of β …

The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of
Sn–3.7 Ag–0.7 Cu; Sn–1.0 Ag–0.5 Cu–1.0 Bi and Sn–1.5 Ag–0.7 Cu–9.5 In (composition …

Microbumps in three-dimensional integrated circuit now becomes essential technology to
reach higher packaging density. However, the small volume of microbumps dramatically …

The diffusion behaviors and diffusion parameters of intermetallic compounds (IMCs) formed
in Cu–Sn diffusion couples were investigated at the temperature range of 130° C–200° C …

In situ observations of the reaction between solid Cu in contact with molten Sn–0.7 wt.% Cu
were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting …